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题名:Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC |
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著者:Er-Ping Li(李尔平) | |
著者单位/学院(系):信息与电子工程学院 | |
出版地:New Jersey | |
出版者:John Wiley &Sons, Inc., Ho. | |
出版时间:2012 | |
ISBN:9780470623466 | |
文库排架号:11/4021/2012 | |
资源类型:图书 |